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Erbium (Er) Sputtering Target

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Product Details

CompositionEr
CAS Number7440-52-0
Purity≥99%
ShapeDiscs, or Custom-made
Diameter2″, 3″, 4″, 5″, 6″, or customized
Thickness0.25″, 0.125″, or customized
Bond TypeCopper, or customized

Erbium (Er) Sputtering Target Description

The Erbium (Er) Sputtering Target is designed to meet the demanding requirements of modern thin-film deposition applications. With a purity of ≥99% and a controlled composition of pure Er, this target promises excellent stability and performance. Its high melting point and precise density make it ideal for semiconductor processing, optical coatings, and materials research. Manufactured to exact specifications, this product is available as standard discs or can be custom-made to suit unique project needs.

Erbium (Er) Sputtering Target Applications

· Semiconductor Processing: Essential in the fabrication of microelectronic and semiconductor devices through thin-film deposition.
· Thin-Film Deposition: Provides uniform and reliable deposition for high-precision optical and electronic components.
· Optical Coatings: Ideal for creating high-quality coatings used in lasers, sensors, and other optical devices.
· Research and Development: Widely employed in scientific research and material science investigations for advanced experimental applications.

Erbium (Er) Sputtering Target Specification

ParameterValue
Material TypeErbium
Purity≥99%, or customized
CAS Number7440-52-0
Melting Point1529℃
Density9.07 g/cm³
SputterDC
Type of BondN/A
Available SizesDia.: 2″, 3″, 4″, or customized

Erbium Sputtering Target Packing

Our products are packaged in customized cartons of various sizes based on the material dimensions. Small items are securely packed in PP boxes, while larger items are placed in custom wooden crates. We ensure strict adherence to packaging customization and the use of appropriate cushioning materials to provide optimal protection during transportation

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