Cerium Oxide (CeO2) Powder (1306-38-3)
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Product Details
| Name | Cerium(IV) Oxide | Molecular Formula | CeO2 | Molecular Weight | 172.115 | |||
|---|---|---|---|---|---|---|---|---|
| Density | 7.65 g/cm3 | Melting Point | 2400℃ | Boiling Point | 3500℃ | |||
| Solubility | Insoluble in water | Appearance | Light Yellow Powder or White powder | CAS Number | 1306-38-3 | |||
| Storage | Store in a dry place | |||||||
Specifications of Cerium Oxide Powder
| Main Compositions ≥ % | |||||
|---|---|---|---|---|---|
| Specifications | CeO2-1 | CeO2-2 | CeO2-3 | CeO2-4 | CeO2-5 |
| TREO(wt%) | 99 | 99 | 99 | 99 | 99 |
| CeO2/TREO | 99.5 | 99.9 | 99.95 | 99.99 | 99.999 |
Cerium Oxide Powder, CeO2 Powder 99% Description
Cerium Oxide Powder (CeO2) is a chemically inert powder widely used in catalytic, polishing, and ceramic applications. Its 99% purity is maintained through strict processing protocols that control particle size distribution. The powder’s consistent chemical composition and structure facilitate reliable performance in abrasive treatments and interface modifications, supporting processes that require precise material interactions.
Cerium Oxide Powder, CeO2 Powder 99% Characteristics
| Characteristic | Value |
| Formula | CeO2 |
| Form | Powder |
| Material | Cerium Oxide |
| CAS Number | 1306-38-3 |
| Commodity | Cerium Compounds |
| Synonyms | Ceric Oxide |
| Molecular Weight | 172.12 g/mol |
| Melting Point (°C) | ~2600°C |
*The above product information is based on theoretical data and is for reference only. Actual specifications may vary.
Cerium Oxide Powder, CeO2 Powder 99% Applications
Electronics and Industrial Applications
– Used as a polishing agent in semiconductor wafer processing to achieve smoother surfaces by leveraging its microabrasive properties.
– Applied as a catalyst in oxidation reactions within industrial systems to facilitate efficient conversion by utilizing its redox characteristics.
Ceramic and Surface Treatment Applications
– Serves as a sintering aid in ceramic formulations to improve densification and microstructural uniformity through its reactivity at high temperatures.
– Frequently used in glass and enamel manufacturing to enhance optical clarity by controlling particle dispersion.
Cerium Oxide Powder, CeO2 Powder 99% Packing
The powder is packed in moisture-resistant, multi-layer pouches, which are then secured inside sealed rigid containers. This packaging design incorporates anti-static measures and moisture barriers to prevent contamination during transit and storage. The product should be stored in a controlled, dry environment with stable temperature conditions. Customized packaging options, including bulk sizes and specific labeling, are available upon request.
Frequently Asked Questions
Q1: What processing methods are used to maintain the powder’s 99% purity?
A1: The powder undergoes controlled calcination and milling, accompanied by rigorous particle size analysis using in-house XRD and TEM methods. These steps ensure that the chemical composition remains at 99% and minimize contaminants that could affect performance in demanding applications.
Q2: How does the particle size distribution impact the performance in polishing applications?
A2: A narrow and controlled particle size distribution enhances the consistency of abrasive action, ensuring uniform surface treatment. This control minimizes surface defects and increases process predictability in applications such as semiconductor wafer polishing and precision surface finishing.
Q3: What storage conditions are recommended to preserve the powder’s properties?
A3: It is recommended to store the powder in a dry environment with stable, moderate temperatures. The multi-layer, moisture-resistant packaging and anti-static features help protect the powder from humidity and contamination, thereby preserving its physical and chemical properties.
